Thermal conductive polymer additive Product family
As electronic devices become highly integrated and space-saving, more heat is emitted. This heat not only degrades device functions, but also causes malfunctions of peripheral devices and substrate degradation. is growing in importance. Examples of the use of heat dissipation materials include engine heat sinks, electronic devices, and LED headlights. Among them, in order to be used as a heat dissipation material for electrical and electronic materials, the thermal conductivity must have a value of 1~30 W/mK or more.
Porous nano-carbon is a material that has developed a thermally conductive nano-carbon material using a carbon material, can control various functional groups, can be manufactured by adjusting the porous size in various ways, and can realize excellent thermal conductivity.
NPC is a material that can be easily percolated into a polymer matrix with a low content by controlling various functional groups and adjusting the porosity size, and is a material that can realize excellent thermal conductivity. Its low price makes it applicable to many applications.
