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Wafer abrasive

As a diamond abrasive, it realizes a high MRR value and is an eco-friendly and easy-to-clean product as a water-soluble abrasive.

Applied to braves with high Material Removal Rate (MRR) to remove scratches left by wire sawing and polishing. Applied to abrasives that can achieve a certain level of surface roughness before polishing (CMP). Applied to abrasives that can achieve high flatness.

Wafer polishing process

Neomond Co., Ltd.

2nd floor, 40-15, Gilju-ro 411beon-gil, Wonmi-gu, Bucheon-si, Gyeonggi-do ㅣ Business registration number 854-88-00610
Tel. 032-684-9750 ㅣ Fax. 032-684-9751 ㅣ